BM10B(0.6)-10DP-0.4V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN HDR 10POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Height Above Board: 0.020" (0.50mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
auf Bestellung 1211 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 38+ | 0.48 EUR |
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Technische Details BM10B(0.6)-10DP-0.4V(51) Hirose Electric Co Ltd
Description: CONN HDR 10POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.016" (0.40mm), Height Above Board: 0.020" (0.50mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM10B(0.6)-10DP-0.4V(51)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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BM10B(0.6)-10DP-0.4V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 10P HDR 0.6 HGHT |
auf Bestellung 4047 Stücke: Lieferzeit 10-14 Tag (e) |
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BM10B(0.6)-10DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 10POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.016" (0.40mm) Height Above Board: 0.020" (0.50mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |