BM10B(0.6)-10DP-0.4V(51) Hirose Connector
Hersteller: Hirose ConnectorBoard to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 10P HDR 0.6 HGHT
auf Bestellung 4047 Stücke:
Lieferzeit 14-28 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details BM10B(0.6)-10DP-0.4V(51) Hirose Connector
Description: CONN HDR 10POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.016" (0.40mm), Height Above Board: 0.020" (0.50mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM10B(0.6)-10DP-0.4V(51)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
 |
BM10B(0.6)-10DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 10POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.016" (0.40mm) Height Above Board: 0.020" (0.50mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
|
|
|
BM10B(0.6)-10DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 10POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.016" (0.40mm) Height Above Board: 0.020" (0.50mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |