BM10B(0.6)-30DP-0.4V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR 30POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Number of Rows: 2
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 2.00µin (0.051µm)
Height Above Board: 0.020" (0.50mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 30
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Header, Outer Shroud Contacts
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Technische Details BM10B(0.6)-30DP-0.4V(51) Hirose Electric Co Ltd
Description: CONN HDR 30POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Number of Rows: 2, Mated Stacking Heights: 0.6mm, Contact Finish Thickness: 2.00µin (0.051µm), Height Above Board: 0.020" (0.50mm), Pitch: 0.016" (0.40mm), Number of Positions: 30, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Header, Outer Shroud Contacts.
Weitere Produktangebote BM10B(0.6)-30DP-0.4V(51)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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BM10B(0.6)-30DP-0.4V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 30POS 0.4MM SMD GOLD CONN HDR |
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