BM10B(0.8)-30DP-0.4V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
Description: CONN HDR 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
auf Bestellung 887 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
13+ | 1.41 EUR |
15+ | 1.2 EUR |
25+ | 1.15 EUR |
50+ | 1.12 EUR |
100+ | 1.07 EUR |
250+ | 0.98 EUR |
500+ | 0.88 EUR |
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Produktbewertung abgeben
Technische Details BM10B(0.8)-30DP-0.4V(51) Hirose Electric Co Ltd
Description: CONN HDR 30POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.016" (0.40mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM10B(0.8)-30DP-0.4V(51)
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
BM10B(0.8)-30DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 30POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM10B(0.8)-30DP-0.4V(51) | Hersteller : Hirose Connector | Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 30P HDR 0.8 HGHT |
Produkt ist nicht verfügbar |