BM10B(0.8)-60DP-0.4V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN HDR 60POS SMD GOLD
Packaging: Tape & Reel (TR)
Features: Solder Retention
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
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Technische Details BM10B(0.8)-60DP-0.4V(51) Hirose Electric Co Ltd
Description: CONN HDR 60POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.016" (0.40mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM10B(0.8)-60DP-0.4V(51)
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BM10B(0.8)-60DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 60POS SMD GOLD Packaging: Cut Tape (CT) Features: Solder Retention Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.016" (0.40mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
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BM10B(0.8)-60DP-0.4V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 60P HDR 0.8 HGHT |
Produkt ist nicht verfügbar |