BM10NB(0.6)-10DS-0.4V(51) Hirose Connector
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 10P RECP 0.6 HGHT
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Technische Details BM10NB(0.6)-10DS-0.4V(51) Hirose Connector
Description: CONN RCPT 10POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.016" (0.40mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.6mm, Part Status: Obsolete, Number of Rows: 2.
Weitere Produktangebote BM10NB(0.6)-10DS-0.4V(51)
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-10DS-0.4V(51).jpg "BM10NB(0.6)-10DS-0.4V(51)") |
BM10NB(0.6)-10DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 10POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.016" (0.40mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.6mm Part Status: Obsolete Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM10NB(0.6)-10DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 10POS SMD GOLD Number of Rows: 2 Part Status: Obsolete Mated Stacking Heights: 0.6mm Contact Finish Thickness: 2.00µin (0.051µm) Height Above Board: 0.024" (0.61mm) Pitch: 0.016" (0.40mm) Number of Positions: 10 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |