BM10NB(0.6)-10DS-0.4V(51) Hirose
auf Bestellung 4 Stücke:
Lieferzeit 14-21 Tag (e)
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Technische Details BM10NB(0.6)-10DS-0.4V(51) Hirose
Description: CONN RCPT 10POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.016" (0.40mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.6mm, Part Status: Obsolete, Number of Rows: 2.
Weitere Produktangebote BM10NB(0.6)-10DS-0.4V(51)
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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BM10NB(0.6)-10DS-0.4V(51) | Hersteller : Hirose Connector | Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 10P RECP 0.6 HGHT |
auf Bestellung 3683 Stücke: Lieferzeit 14-28 Tag (e) |
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BM10NB(0.6)-10DS-0.4V(51) | Hersteller : Hirose | Conn Board to Board RCP 10 POS 0.4mm Solder ST Top Entry SMD T/R |
Produkt ist nicht verfügbar |
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BM10NB(0.6)-10DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 10POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.016" (0.40mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.6mm Part Status: Obsolete Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM10NB(0.6)-10DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 10POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.016" (0.40mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.6mm Part Status: Obsolete Number of Rows: 2 |
Produkt ist nicht verfügbar |