Produkte > HIROSE CONNECTOR > BM10NB(0.6)-10DS-0.4V(51)
BM10NB(0.6)-10DS-0.4V(51)

BM10NB(0.6)-10DS-0.4V(51) Hirose Connector

BM10_catalog-938925.pdf
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 10P RECP 0.6 HGHT
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Lieferzeit 10-14 Tag (e)
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Technische Details BM10NB(0.6)-10DS-0.4V(51) Hirose Connector

Description: CONN RCPT 10POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.016" (0.40mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.6mm, Part Status: Obsolete, Number of Rows: 2.

Weitere Produktangebote BM10NB(0.6)-10DS-0.4V(51)

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
BM10NB(0.6)-10DS-0.4V(51) BM10NB(0.6)-10DS-0.4V(51) Hirose Electric Co Ltd document?clcode=CL0684-6304-0-51&productname=BM10B(0.6)-10DP-0.4V(51)&series=BM10&documenttype=Catalog&lang=en&documentid=D47235_en Description: CONN RCPT 10POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.6mm
Part Status: Obsolete
Number of Rows: 2
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BM10NB(0.6)-10DS-0.4V(51) BM10NB(0.6)-10DS-0.4V(51) Hirose Electric Co Ltd document?clcode=CL0684-6304-0-51&productname=BM10B(0.6)-10DP-0.4V(51)&series=BM10&documenttype=Catalog&lang=en&documentid=D47235_en Description: CONN RCPT 10POS SMD GOLD
Number of Rows: 2
Part Status: Obsolete
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 2.00µin (0.051µm)
Height Above Board: 0.024" (0.61mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 10
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BM10NB(0.6)-10DS-0.4V(51) document?clcode=CL0684-6304-0-51&productname=BM10B(0.6)-10DP-0.4V(51)&series=BM10&documenttype=Catalog&lang=en&documentid=D47235_en
BM10NB(0.6)-10DS-0.4V(51)
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 10POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.6mm
Part Status: Obsolete
Number of Rows: 2
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BM10NB(0.6)-10DS-0.4V(51) document?clcode=CL0684-6304-0-51&productname=BM10B(0.6)-10DP-0.4V(51)&series=BM10&documenttype=Catalog&lang=en&documentid=D47235_en
BM10NB(0.6)-10DS-0.4V(51)
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 10POS SMD GOLD
Number of Rows: 2
Part Status: Obsolete
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 2.00µin (0.051µm)
Height Above Board: 0.024" (0.61mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 10
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH