BM14B(0.8)-40DS-0.4V(53) Hirose Electric Co Ltd

Description: CONN RCPT 40POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
auf Bestellung 996 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
7+ | 2.66 EUR |
10+ | 2.16 EUR |
25+ | 1.99 EUR |
50+ | 1.88 EUR |
100+ | 1.76 EUR |
250+ | 1.63 EUR |
500+ | 1.53 EUR |
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Technische Details BM14B(0.8)-40DS-0.4V(53) Hirose Electric Co Ltd
Description: CONN RCPT 40POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 40, Pitch: 0.016" (0.40mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM14B(0.8)-40DS-0.4V(53)
Foto | Bezeichnung | Hersteller | Beschreibung |
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Preis |
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BM14B(0.8)-40DS-0.4V(53) | Hersteller : HIROSE |
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Produkt ist nicht verfügbar |
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BM14B(0.8)-40DS-0.4V(53) | Hersteller : Hirose Electric Co Ltd |
![]() Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.016" (0.40mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM14B(0.8)-40DS-0.4V(53) | Hersteller : Hirose Connector |
![]() |
Produkt ist nicht verfügbar |