BM14B(0.8)-60DS-0.4V(53) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 60POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
auf Bestellung 885 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 3.19 EUR |
| 10+ | 2.71 EUR |
| 25+ | 2.54 EUR |
| 50+ | 2.42 EUR |
| 100+ | 2.3 EUR |
| 250+ | 2.16 EUR |
| 500+ | 2.06 EUR |
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Technische Details BM14B(0.8)-60DS-0.4V(53) Hirose Electric Co Ltd
Description: CONN RCPT 60POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.016" (0.40mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM14B(0.8)-60DS-0.4V(53)
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BM14B(0.8)-60DS-0.4V(53) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 60POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.016" (0.40mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM14B(0.8)-60DS-0.4V(53) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 60P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSM |
Produkt ist nicht verfügbar |