-60DS-0.4V(53).jpg "BM14B(0.8)-60DS-0.4V(53)")
BM14B(0.8)-60DS-0.4V(53) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 60POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details BM14B(0.8)-60DS-0.4V(53) Hirose Electric Co Ltd
Description: CONN RCPT 60POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.016" (0.40mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM14B(0.8)-60DS-0.4V(53)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| BM14B(0.8)-60DS-0.4V(53) | Hersteller : HIROSE |
BM14B0.8-60DS-0.4V Other Hirose Connectors |
Produkt ist nicht verfügbar |
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BM14B(0.8)-60DS-0.4V(53) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 60POS SMD GOLD Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.016" (0.40mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM14B(0.8)-60DS-0.4V(53) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 60P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSM |
Produkt ist nicht verfügbar |