BM20B(0.6)-20DS-0.4V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 20POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
auf Bestellung 7911 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10+ | 1.85 EUR |
| 12+ | 1.51 EUR |
| 25+ | 1.39 EUR |
| 50+ | 1.31 EUR |
| 100+ | 1.23 EUR |
| 250+ | 1.14 EUR |
| 500+ | 1.07 EUR |
| 1000+ | 1 EUR |
| 2500+ | 0.93 EUR |
Produktrezensionen
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Technische Details BM20B(0.6)-20DS-0.4V(51) Hirose Electric Co Ltd
Description: CONN RCPT 20POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 20, Pitch: 0.016" (0.40mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM20B(0.6)-20DS-0.4V(51)
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BM20B(0.6)-20DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 20POS SMD GOLD Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.016" (0.40mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM20B(0.6)-20DS-0.4V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 20P DR RCP B2B/B2FPC 0.6mm H 0.4mm P VSM |
Produkt ist nicht verfügbar |