BM20B(0.6)-24DS-0.4V(53) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 24POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.6mm
Part Status: Active
Number of Rows: 2
auf Bestellung 995 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10+ | 1.88 EUR |
| 12+ | 1.53 EUR |
| 25+ | 1.41 EUR |
| 50+ | 1.33 EUR |
| 100+ | 1.25 EUR |
| 250+ | 1.15 EUR |
| 500+ | 1.08 EUR |
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Technische Details BM20B(0.6)-24DS-0.4V(53) Hirose Electric Co Ltd
Description: CONN RCPT 24POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 24, Pitch: 0.016" (0.40mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.6mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM20B(0.6)-24DS-0.4V(53)
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BM20B(0.6)-24DS-0.4V(53) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 24POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.016" (0.40mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.6mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM20B(0.6)-24DS-0.4V(53) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 24P DR RCP B2B/B2FPC 0.6mm H 0.4mm P VSM |
Produkt ist nicht verfügbar |