BM20B(0.8)-20DS-0.4V(51) Hirose Connector
Hersteller: Hirose ConnectorBoard to Board & Mezzanine Connectors 20P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSM
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.76 EUR |
| 10+ | 1.24 EUR |
| 100+ | 1.08 EUR |
| 500+ | 1.02 EUR |
| 1000+ | 0.95 EUR |
| 2500+ | 0.88 EUR |
| 8000+ | 0.87 EUR |
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Technische Details BM20B(0.8)-20DS-0.4V(51) Hirose Connector
Description: CONN RCPT 20POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 20, Pitch: 0.016" (0.40mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM20B(0.8)-20DS-0.4V(51) nach Preis ab 0.94 EUR bis 2.25 EUR
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BM20B(0.8)-20DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 20POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.016" (0.40mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
auf Bestellung 5699 Stücke: Lieferzeit 10-14 Tag (e) |
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BM20B(0.8)-20DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 20POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.016" (0.40mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
Produkt ist nicht verfügbar |