BM20B(0.8)-50DP-0.4V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN HDR 50POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 50
Pitch: 0.016" (0.40mm)
Height Above Board: 0.026" (0.65mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
auf Bestellung 7901 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 9+ | 2.08 EUR |
| 10+ | 1.77 EUR |
| 25+ | 1.66 EUR |
| 50+ | 1.58 EUR |
| 100+ | 1.5 EUR |
| 250+ | 1.41 EUR |
| 500+ | 1.34 EUR |
| 1000+ | 1.28 EUR |
| 2500+ | 1.24 EUR |
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Technische Details BM20B(0.8)-50DP-0.4V(51) Hirose Electric Co Ltd
Description: CONN HDR 50POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 50, Pitch: 0.016" (0.40mm), Height Above Board: 0.026" (0.65mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM20B(0.8)-50DP-0.4V(51)
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BM20B(0.8)-50DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 50POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 50 Pitch: 0.016" (0.40mm) Height Above Board: 0.026" (0.65mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM20B(0.8)-50DP-0.4V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |