Produkte > HIROSE ELECTRIC CO LTD > BM23FR0.6-10DS-0.35V(51)
BM23FR0.6-10DS-0.35V(51)

BM23FR0.6-10DS-0.35V(51) Hirose Electric Co Ltd


document?clcode=CL0480-0257-0-51&productname=BM23FR0.6-10DP-0.35V(51)&series=BM23FR&documenttype=Catalog&lang=en&documentid=D162519_en Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 10POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.014" (0.35mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
auf Bestellung 9515 Stücke:

Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
14+1.87 EUR
17+ 1.59 EUR
25+ 1.52 EUR
50+ 1.49 EUR
100+ 1.43 EUR
250+ 1.3 EUR
500+ 1.17 EUR
1000+ 1.04 EUR
2500+ 0.94 EUR
Mindestbestellmenge: 14
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Technische Details BM23FR0.6-10DS-0.35V(51) Hirose Electric Co Ltd

Description: CONN RCPT 10POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.014" (0.35mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.

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BM23FR0.6-10DS-0.35V(51) Hersteller : HIROSE document?clcode=CL0480-0257-0-51&productname=BM23FR0.6-10DP-0.35V(51)&series=BM23FR&documenttype=Catalog&lang=en&documentid=D162519_en BM23FR0610DS035V51 Other Hirose Connectors
Produkt ist nicht verfügbar
BM23FR0.6-10DS-0.35V(51) BM23FR0.6-10DS-0.35V(51) Hersteller : Hirose Electric Co Ltd document?clcode=CL0480-0257-0-51&productname=BM23FR0.6-10DP-0.35V(51)&series=BM23FR&documenttype=Catalog&lang=en&documentid=D162519_en Description: CONN RCPT 10POS SMD GOLD
Packaging: Tape & Reel (TR)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.014" (0.35mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
Produkt ist nicht verfügbar
BM23FR0.6-10DS-0.35V(51) BM23FR0.6-10DS-0.35V(51) Hersteller : Hirose Connector BM23FR0_6_10DS_0_35V_51__CL0480_0258_0_51_2DDrawin-1610807.pdf Board to Board & Mezzanine Connectors
Produkt ist nicht verfügbar