BM23FR0.8-18DP-0.35V(895) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN HDR 18POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
auf Bestellung 947 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 11+ | 1.64 EUR |
| 13+ | 1.38 EUR |
| 25+ | 1.3 EUR |
| 50+ | 1.23 EUR |
| 100+ | 1.17 EUR |
| 250+ | 1.1 EUR |
| 500+ | 1.05 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM23FR0.8-18DP-0.35V(895) Hirose Electric Co Ltd
Description: CONN HDR 18POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 18, Pitch: 0.014" (0.35mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM23FR0.8-18DP-0.35V(895)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
|
|
BM23FR0.8-18DP-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 18POS SMD GOLD Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 18 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
|
 |
BM23FR0.8-18DP-0.35V(895) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 18P HDR STRGHT SMT SIGNAL ONLY |
Produkt ist nicht verfügbar |