BM23FR0.8-18DP-0.35V(895) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR 18POS SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.025" (0.63mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 18
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Header, Outer Shroud Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
| Anzahl | Preis |
|---|---|
| 11+ | 1.64 EUR |
| 13+ | 1.38 EUR |
| 25+ | 1.3 EUR |
| 50+ | 1.23 EUR |
| 100+ | 1.17 EUR |
| 250+ | 1.1 EUR |
| 500+ | 1.05 EUR |
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Technische Details BM23FR0.8-18DP-0.35V(895) Hirose Electric Co Ltd
Description: CONN HDR 18POS SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 0.8mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.025" (0.63mm), Pitch: 0.014" (0.35mm), Number of Positions: 18, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Header, Outer Shroud Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote BM23FR0.8-18DP-0.35V(895)
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BM23FR0.8-18DP-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 18POS SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.025" (0.63mm) Pitch: 0.014" (0.35mm) Number of Positions: 18 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Header, Outer Shroud Contacts Features: Solder Retention Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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BM23FR0.8-18DP-0.35V(895) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 18P HDR STRGHT SMT SIGNAL ONLY |
Produkt ist nicht verfügbar |