Produkte > HIROSE CONNECTOR > BM23FR0.8-18DS-0.35V(895)
BM23FR0.8-18DS-0.35V(895)

BM23FR0.8-18DS-0.35V(895) Hirose Connector

BM23FR_Catalog_D162519_en-2585886.pdf Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 18P RCPT STRGHT SMT SIGNAL ONLY
auf Bestellung 761 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+1.9 EUR
10+ 1.62 EUR
100+ 1.45 EUR
500+ 1.19 EUR
1000+ 1.06 EUR
2000+ 0.96 EUR
5000+ 0.92 EUR
Mindestbestellmenge: 2
Produktrezensionen
Produktbewertung abgeben

Technische Details BM23FR0.8-18DS-0.35V(895) Hirose Connector

Description: CONN RCPT 18POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 18, Pitch: 0.014" (0.35mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.

Weitere Produktangebote BM23FR0.8-18DS-0.35V(895) nach Preis ab 1.2 EUR bis 1.94 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
BM23FR0.8-18DS-0.35V(895) BM23FR0.8-18DS-0.35V(895) Hersteller : Hirose Electric Co Ltd ?distributor=digikey&type=specSheet&lang=en&num=BM23FR0.8-18DS-0.35V(895) Description: CONN RCPT 18POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.014" (0.35mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
auf Bestellung 960 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
10+1.94 EUR
11+ 1.63 EUR
25+ 1.56 EUR
50+ 1.53 EUR
100+ 1.46 EUR
250+ 1.33 EUR
500+ 1.2 EUR
Mindestbestellmenge: 10
BM23FR0.8-18DS-0.35V(895) BM23FR0.8-18DS-0.35V(895) Hersteller : Hirose Electric Co Ltd ?distributor=digikey&type=specSheet&lang=en&num=BM23FR0.8-18DS-0.35V(895) Description: CONN RCPT 18POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.014" (0.35mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar