BM23FR0.8-18DS-0.35V(895) Hirose Connector
auf Bestellung 1808 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.76 EUR |
| 10+ | 1.24 EUR |
| 100+ | 1.08 EUR |
| 500+ | 1.01 EUR |
| 1000+ | 0.95 EUR |
| 2000+ | 0.87 EUR |
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Technische Details BM23FR0.8-18DS-0.35V(895) Hirose Connector
Description: CONN RCPT 18POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 18, Pitch: 0.014" (0.35mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM23FR0.8-18DS-0.35V(895) nach Preis ab 1.46 EUR bis 1.94 EUR
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BM23FR0.8-18DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
 Description: CONN RCPT 18POS SMD GOLDPackaging: Cut Tape (CT) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 18 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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BM23FR0.8-18DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 18POS SMD GOLD Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 18 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |