BM23FR0.8-18DS-0.35V(895) Hirose Connector
| Anzahl | Preis |
|---|---|
| 2+ | 1.76 EUR |
| 10+ | 1.24 EUR |
| 100+ | 1.08 EUR |
| 500+ | 1.01 EUR |
| 1000+ | 0.95 EUR |
| 2000+ | 0.87 EUR |
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Technische Details BM23FR0.8-18DS-0.35V(895) Hirose Connector
Description: CONN RCPT 18POS SMD GOLD, Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 0.8mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.031" (0.80mm), Pitch: 0.014" (0.35mm), Number of Positions: 18, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote BM23FR0.8-18DS-0.35V(895) nach Preis ab 1.46 EUR bis 1.94 EUR
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BM23FR0.8-18DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
 Description: CONN RCPT 18POS SMD GOLDNumber of Rows: 2 Part Status: Active Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.014" (0.35mm) Number of Positions: 18 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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