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BM23FR0.8-60DS-0.35V(895)

BM23FR0.8-60DS-0.35V(895) Hirose Electric Co Ltd


?distributor=digikey&type=specSheet&lang=en&num=BM23FR0.8-60DS-0.35V(895) Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 60POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
auf Bestellung 557 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+3.1 EUR
10+ 2.7 EUR
25+ 2.58 EUR
50+ 2.53 EUR
100+ 2.41 EUR
250+ 2.18 EUR
500+ 2.01 EUR
Mindestbestellmenge: 6
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Technische Details BM23FR0.8-60DS-0.35V(895) Hirose Electric Co Ltd

Description: CONN RCPT 60POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.014" (0.35mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.

Weitere Produktangebote BM23FR0.8-60DS-0.35V(895)

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
BM23FR0.8-60DS-0.35V(895) BM23FR0.8-60DS-0.35V(895) Hersteller : Hirose Connector BM23FR_CL0480_0300_0_95_2d-1610951.pdf Board to Board & Mezzanine Connectors 60P RCPT STRGHT SMT SIGNAL ONLY
auf Bestellung 883 Stücke:
Lieferzeit 14-28 Tag (e)
BM23FR0.8-60DS-0.35V(895) BM23FR0.8-60DS-0.35V(895) Hersteller : Hirose Electric Co Ltd ?distributor=digikey&type=specSheet&lang=en&num=BM23FR0.8-60DS-0.35V(895) Description: CONN RCPT 60POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
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