BM23PF0.8-20DS-0.35V(895) Hirose Connector
Hersteller: Hirose ConnectorBoard to Board & Mezzanine Connectors 20P RCPT STRGHT SMT HYBRID W/POWER
auf Bestellung 3161 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.88 EUR |
| 10+ | 1.33 EUR |
| 100+ | 1.15 EUR |
| 500+ | 1.08 EUR |
| 1000+ | 1.02 EUR |
| 5000+ | 0.94 EUR |
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Produktbewertung abgeben
Technische Details BM23PF0.8-20DS-0.35V(895) Hirose Connector
Description: CONN RCPT 20POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 20, Pitch: 0.014" (0.35mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM23PF0.8-20DS-0.35V(895) nach Preis ab 1.09 EUR bis 1.90 EUR
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BM23PF0.8-20DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 20POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
auf Bestellung 1150 Stücke: Lieferzeit 10-14 Tag (e) |
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BM23PF0.8-20DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 20POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |