BM23PF0.8-20DS-0.35V(895) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 20POS SMD GOLD
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.031" (0.80mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 20
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 2.01 EUR |
| 13+ | 1.64 EUR |
| 25+ | 1.51 EUR |
| 50+ | 1.42 EUR |
| 100+ | 1.33 EUR |
| 250+ | 1.23 EUR |
| 500+ | 1.15 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM23PF0.8-20DS-0.35V(895) Hirose Electric Co Ltd
Description: CONN RCPT 20POS SMD GOLD, Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 0.8mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.031" (0.80mm), Pitch: 0.014" (0.35mm), Number of Positions: 20, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote BM23PF0.8-20DS-0.35V(895) nach Preis ab 1.4 EUR bis 2.26 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
BM23PF0.8-20DS-0.35V(895) | Hirose Connector |
Board to Board & Mezzanine Connectors 20P RCPT STRGHT SMT HYBRID W/POWER |
auf Bestellung 937 Stücke: Lieferzeit 10-14 Tag (e) |
|
| BM23PF0.8-20DS-0.35V(895) |
![]() |
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 20P RCPT STRGHT SMT HYBRID W/POWER
Board to Board & Mezzanine Connectors 20P RCPT STRGHT SMT HYBRID W/POWER
auf Bestellung 937 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.26 EUR |
| 10+ | 1.92 EUR |
| 25+ | 1.83 EUR |
| 50+ | 1.8 EUR |
| 100+ | 1.71 EUR |
| 250+ | 1.56 EUR |
| 500+ | 1.4 EUR |


