
BM23PF0.8-20DS-0.35V(895) Hirose Electric Co Ltd

Description: CONN RCPT 20POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.014" (0.35mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
auf Bestellung 1150 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
10+ | 1.9 EUR |
12+ | 1.54 EUR |
25+ | 1.42 EUR |
50+ | 1.33 EUR |
100+ | 1.25 EUR |
250+ | 1.15 EUR |
500+ | 1.09 EUR |
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Produktbewertung abgeben
Technische Details BM23PF0.8-20DS-0.35V(895) Hirose Electric Co Ltd
Description: CONN RCPT 20POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 20, Pitch: 0.014" (0.35mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM23PF0.8-20DS-0.35V(895) nach Preis ab 1.24 EUR bis 1.99 EUR
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BM23PF0.8-20DS-0.35V(895) | Hersteller : Hirose Connector |
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auf Bestellung 2046 Stücke: Lieferzeit 10-14 Tag (e) |
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BM23PF0.8-20DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |