Produkte > HIROSE ELECTRIC CO LTD > BM23PF0.8-30DP-0.35V(51)
BM23PF0.8-30DP-0.35V(51)

BM23PF0.8-30DP-0.35V(51) Hirose Electric Co Ltd

document?clcode=CL0480-0367-0-95&productname=BM23PF0.8-14DS-0.35V(895)&series=BM23PF&documenttype=Catalog&lang=en&documentid=D165617_en
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
auf Bestellung 5185 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
12+1.76 EUR
15+1.43 EUR
25+1.32 EUR
50+1.24 EUR
100+1.17 EUR
250+1.07 EUR
500+1.01 EUR
1000+0.95 EUR
2500+0.87 EUR
Mindestbestellmenge: 12 Stücke
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Technische Details BM23PF0.8-30DP-0.35V(51) Hirose Electric Co Ltd

Description: CONN HDR 30POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.014" (0.35mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.

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BM23PF0.8-30DP-0.35V(51) BM23PF0.8-30DP-0.35V(51) Hirose Electric Co Ltd document?clcode=CL0480-0367-0-95&productname=BM23PF0.8-14DS-0.35V(895)&series=BM23PF&documenttype=Catalog&lang=en&documentid=D165617_en Description: CONN HDR 30POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
Produkt ist nicht verfügbar
 Mindestbestellmenge: 10000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
BM23PF0.8-30DP-0.35V(51) BM23PF0.8-30DP-0.35V(51) Hirose Connector BM23PF0.8_30DP_0.35V_51__CL0480_0426_0_51_2DDrawing_BM23PF0.8_DP_0.35V_51__2D_ENG_Multi_.pdf Board to Board & Mezzanine Connectors 30P HDR STRGHT SMT HYBRID W/POWER
Produkt ist nicht verfügbar
 Mindestbestellmenge: 10000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
BM23PF0.8-30DP-0.35V(51) document?clcode=CL0480-0367-0-95&productname=BM23PF0.8-14DS-0.35V(895)&series=BM23PF&documenttype=Catalog&lang=en&documentid=D165617_en
BM23PF0.8-30DP-0.35V(51)
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR 30POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
Produkt ist nicht verfügbar
Mindestbestellmenge: 10000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
BM23PF0.8-30DP-0.35V(51) BM23PF0.8_30DP_0.35V_51__CL0480_0426_0_51_2DDrawing_BM23PF0.8_DP_0.35V_51__2D_ENG_Multi_.pdf
BM23PF0.8-30DP-0.35V(51)
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 30P HDR STRGHT SMT HYBRID W/POWER
Produkt ist nicht verfügbar
Mindestbestellmenge: 10000 Stücke
Im Einkaufswagen  Stück im Wert von  UAH