BM23PF0.8-30DP-0.35V(895) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN HDR 30POS SMD GOLD
Packaging: Tape & Reel (TR)
Features: Solder Retention
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1000+ | 1.15 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM23PF0.8-30DP-0.35V(895) Hirose Electric Co Ltd
Description: CONN HDR 30POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.014" (0.35mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM23PF0.8-30DP-0.35V(895) nach Preis ab 1.01 EUR bis 1.88 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
BM23PF0.8-30DP-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 30POS SMD GOLD Packaging: Cut Tape (CT) Features: Solder Retention Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
auf Bestellung 2468 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
BM23PF0.8-30DP-0.35V(895) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 30P HDR STRGHT SMT HYBRID W/POWER |
auf Bestellung 495 Stücke: Lieferzeit 10-14 Tag (e) |
|