BM23PF0.8-54DP-0.35V(895) Hirose Connector
Hersteller: Hirose ConnectorBoard to Board & Mezzanine Connectors 54P HDR STRGHT SMT HYBRID W/POWER
auf Bestellung 141 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 2.97 EUR |
| 10+ | 2.11 EUR |
| 100+ | 1.83 EUR |
| 500+ | 1.72 EUR |
| 1000+ | 1.61 EUR |
| 2000+ | 1.55 EUR |
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Technische Details BM23PF0.8-54DP-0.35V(895) Hirose Connector
Description: CONN HDR 54POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 54, Pitch: 0.014" (0.35mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM23PF0.8-54DP-0.35V(895) nach Preis ab 1.72 EUR bis 2.97 EUR
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BM23PF0.8-54DP-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 54POS SMD GOLD Packaging: Cut Tape (CT) Features: Solder Retention Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 54 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
auf Bestellung 911 Stücke: Lieferzeit 10-14 Tag (e) |
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BM23PF0.8-54DP-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 54POS SMD GOLD Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 54 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |