BM28B0.6-18DP/2-0.35V(53) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR SMD GOLD
Packaging: Tape & Reel (TR)
Features: Solder Retention
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 20 (18 + 2 Power)
Pitch: 0.014" (0.35mm)
Height Above Board: 0.018" (0.46mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
Description: CONN HDR SMD GOLD
Packaging: Tape & Reel (TR)
Features: Solder Retention
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 20 (18 + 2 Power)
Pitch: 0.014" (0.35mm)
Height Above Board: 0.018" (0.46mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
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Technische Details BM28B0.6-18DP/2-0.35V(53) Hirose Electric Co Ltd
Description: CONN HDR SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 20 (18 + 2 Power), Pitch: 0.014" (0.35mm), Height Above Board: 0.018" (0.46mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM28B0.6-18DP/2-0.35V(53)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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BM28B0.6-18DP/2-0.35V(53) | Hersteller : Hirose Connector |
 Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |