BSW-110-04-G-S Samtec
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 4.8 EUR |
| 50+ | 3.92 EUR |
| 100+ | 3.33 EUR |
| 500+ | 2.97 EUR |
| 1000+ | 2.89 EUR |
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Technische Details BSW-110-04-G-S Samtec
Description: CONN RCPT 10POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Receptacle, Mounting Type: Through Hole, Bottom Mount, Number of Positions: 10, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.170" (4.32mm), Insulation Height: 0.350" (8.89mm), Number of Rows: 1.
Weitere Produktangebote BSW-110-04-G-S
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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BSW-110-04-G-S | Hersteller : Samtec Inc. |
 Description: CONN RCPT 10POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Receptacle Mounting Type: Through Hole, Bottom Mount Number of Positions: 10 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.170" (4.32mm) Insulation Height: 0.350" (8.89mm) Number of Rows: 1 |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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BSW-110-04-G-S | Hersteller : Samtec |
Conn Bottom Mount Socket Strip SKT 10 POS 2.54mm Solder ST Bottom Entry Thru-Hole Bulk |
Produkt ist nicht verfügbar |