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C2012JB0J685M085AB

C2012JB0J685M085AB TDK Corporation


Multilayer Ceramic Chip Cap(up to 50V).pdf Hersteller: TDK Corporation
Description: CAP CER 6.8UF 6.3V JB 0805
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Features: Low ESL
Voltage - Rated: 6.3V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: JB
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -25°C ~ 85°C
Applications: General Purpose
Thickness (Max): 0.037" (0.95mm)
Part Status: Obsolete
Capacitance: 6.8 µF
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Technische Details C2012JB0J685M085AB TDK Corporation

Description: CAP CER 6.8UF 6.3V JB 0805, Packaging: Tape & Reel (TR), Tolerance: ±20%, Features: Low ESL, Voltage - Rated: 6.3V, Package / Case: 0805 (2012 Metric), Temperature Coefficient: JB, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -25°C ~ 85°C, Applications: General Purpose, Thickness (Max): 0.037" (0.95mm), Part Status: Obsolete, Capacitance: 6.8 µF.

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C2012JB0J685M085AB C2012JB0J685M085AB Hersteller : TDK Corporation Multilayer Ceramic Chip Cap(up to 50V).pdf Description: CAP CER 6.8UF 6.3V JB 0805
Packaging: Cut Tape (CT)
Tolerance: ±20%
Features: Low ESL
Voltage - Rated: 6.3V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: JB
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -25°C ~ 85°C
Applications: General Purpose
Thickness (Max): 0.037" (0.95mm)
Part Status: Obsolete
Capacitance: 6.8 µF
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH