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C2012X5R1A106M125AB

C2012X5R1A106M125AB TDK Corporation


Multilayer%20Ceramic%20Chip%20Cap%28up%20to%2050V%29.pdf Hersteller: TDK Corporation
Description: CAP CER 10UF 10V X5R 0805
Tolerance: ±20%
Features: Low ESL
Packaging: Tape & Reel (TR)
Voltage - Rated: 10V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X5R
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 85°C
Applications: General Purpose
Thickness (Max): 0.057" (1.45mm)
Capacitance: 10 µF
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Technische Details C2012X5R1A106M125AB TDK Corporation

Description: CAP CER 10UF 10V X5R 0805, Tolerance: ±20%, Features: Low ESL, Packaging: Tape & Reel (TR), Voltage - Rated: 10V, Package / Case: 0805 (2012 Metric), Temperature Coefficient: X5R, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 85°C, Applications: General Purpose, Thickness (Max): 0.057" (1.45mm), Capacitance: 10 µF.

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C2012X5R1A106M125AB C2012X5R1A106M125AB Hersteller : TDK Corporation Multilayer%20Ceramic%20Chip%20Cap%28up%20to%2050V%29.pdf Description: CAP CER 10UF 10V X5R 0805
Tolerance: ±20%
Features: Low ESL
Packaging: Cut Tape (CT)
Voltage - Rated: 10V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X5R
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 85°C
Applications: General Purpose
Thickness (Max): 0.057" (1.45mm)
Capacitance: 10 µF
Produkt ist nicht verfügbar