CL21B224KBFSFNE

CL21B224KBFSFNE Samsung Electro-Mechanics


MLCC.pdf Hersteller: Samsung Electro-Mechanics
Description: CAP CER 0.22UF 50V X7R 0805
Tolerance: ±10%
Features: Soft Termination
Packaging: Tape & Reel (TR)
Voltage - Rated: 50V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Boardflex Sensitive
Thickness (Max): 0.053" (1.35mm)
Capacitance: 0.22 µF
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Technische Details CL21B224KBFSFNE Samsung Electro-Mechanics

Description: CAP CER 0.22UF 50V X7R 0805, Tolerance: ±10%, Features: Soft Termination, Packaging: Tape & Reel (TR), Voltage - Rated: 50V, Package / Case: 0805 (2012 Metric), Temperature Coefficient: X7R, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 125°C, Applications: Boardflex Sensitive, Thickness (Max): 0.053" (1.35mm), Capacitance: 0.22 µF.

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CL21B224KBFSFNE CL21B224KBFSFNE Hersteller : Samsung Electro-Mechanics MLCC.pdf Description: CAP CER 0.22UF 50V X7R 0805
Tolerance: ±10%
Features: Soft Termination
Packaging: Cut Tape (CT)
Voltage - Rated: 50V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Boardflex Sensitive
Thickness (Max): 0.053" (1.35mm)
Capacitance: 0.22 µF
Produkt ist nicht verfügbar