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CL21B334KAFNNNE

CL21B334KAFNNNE SAMSUNGEM


cl21b334kafnnn_specsheet.pdf Hersteller: SAMSUNGEM
Cap Ceramic 0.33uF 25V X7R 10% Pad SMD 0805 125C T/R
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Technische Details CL21B334KAFNNNE SAMSUNGEM

Description: CAP CER 0.33UF 25V X7R 0805, Packaging: Tape & Reel (TR), Tolerance: ±10%, Voltage - Rated: 25V, Package / Case: 0805 (2012 Metric), Temperature Coefficient: X7R, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 125°C, Applications: General Purpose, Thickness (Max): 0.053" (1.35mm), Capacitance: 0.33 µF.

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CL21B334KAFNNNE CL21B334KAFNNNE Hersteller : Samsung Electro-Mechanics MLCC.pdf Description: CAP CER 0.33UF 25V X7R 0805
Packaging: Tape & Reel (TR)
Tolerance: ±10%
Voltage - Rated: 25V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Thickness (Max): 0.053" (1.35mm)
Capacitance: 0.33 µF
Produkt ist nicht verfügbar
CL21B334KAFNNNE CL21B334KAFNNNE Hersteller : Samsung Electro-Mechanics MLCC.pdf Description: CAP CER 0.33UF 25V X7R 0805
Packaging: Cut Tape (CT)
Tolerance: ±10%
Voltage - Rated: 25V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Thickness (Max): 0.053" (1.35mm)
Capacitance: 0.33 µF
Produkt ist nicht verfügbar