Produkte > SAMSUNGEM > CL21B475KQFNNNE
CL21B475KQFNNNE

CL21B475KQFNNNE SAMSUNGEM


cl21b475kqfnnn_specsheet.pdf Hersteller: SAMSUNGEM
Cap Ceramic 4.7uF 6.3V X7R 10% Pad SMD 0805 125C T/R
Produkt ist nicht verfügbar

Produktrezensionen
Produktbewertung abgeben

Technische Details CL21B475KQFNNNE SAMSUNGEM

Description: CAP CER 4.7UF 6.3V X7R 0805, Tolerance: ±10%, Packaging: Tape & Reel (TR), Voltage - Rated: 6.3V, Package / Case: 0805 (2012 Metric), Temperature Coefficient: X7R, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 125°C, Applications: General Purpose, Thickness (Max): 0.053" (1.35mm), Capacitance: 4.7 µF.

Weitere Produktangebote CL21B475KQFNNNE

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
CL21B475KQFNNNE CL21B475KQFNNNE Hersteller : Samsung Electro-Mechanics MLCC.pdf Description: CAP CER 4.7UF 6.3V X7R 0805
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Voltage - Rated: 6.3V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Thickness (Max): 0.053" (1.35mm)
Capacitance: 4.7 µF
Produkt ist nicht verfügbar
CL21B475KQFNNNE CL21B475KQFNNNE Hersteller : Samsung Electro-Mechanics MLCC.pdf Description: CAP CER 4.7UF 6.3V X7R 0805
Packaging: Cut Tape (CT)
Tolerance: ±10%
Voltage - Rated: 6.3V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Thickness (Max): 0.053" (1.35mm)
Capacitance: 4.7 µF
Produkt ist nicht verfügbar