CL31A226KAHZNNE Samsung Electro-Mechanics
Hersteller: Samsung Electro-MechanicsCap Ceramic 22uF 25V X5R 10% Pad SMD 1206 Soft Termination 85°C T/R
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Technische Details CL31A226KAHZNNE Samsung Electro-Mechanics
Description: CAP CER 22UF 25V X5R 1206, Tolerance: ±10%, Features: Soft Termination, Packaging: Tape & Reel (TR), Voltage - Rated: 25V, Package / Case: 1206 (3216 Metric), Temperature Coefficient: X5R, Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 85°C, Applications: Boardflex Sensitive, Thickness (Max): 0.071" (1.80mm), Part Status: Active, Capacitance: 22 µF.
Weitere Produktangebote CL31A226KAHZNNE
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CL31A226KAHZNNE | Hersteller : Samsung Electro-Mechanics |
Description: CAP CER 22UF 25V X5R 1206 Tolerance: ±10% Features: Soft Termination Packaging: Tape & Reel (TR) Voltage - Rated: 25V Package / Case: 1206 (3216 Metric) Temperature Coefficient: X5R Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 85°C Applications: Boardflex Sensitive Thickness (Max): 0.071" (1.80mm) Part Status: Active Capacitance: 22 µF |
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CL31A226KAHZNNE | Hersteller : Samsung Electro-Mechanics |
Description: CAP CER 22UF 25V X5R 1206 Tolerance: ±10% Features: Soft Termination Packaging: Cut Tape (CT) Voltage - Rated: 25V Package / Case: 1206 (3216 Metric) Temperature Coefficient: X5R Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 85°C Applications: Boardflex Sensitive Thickness (Max): 0.071" (1.80mm) Part Status: Active Capacitance: 22 µF |
Produkt ist nicht verfügbar |