CLM-108-02-L-D Samtec Inc.
Hersteller: Samtec Inc.Description: CONN RCPT 16POS 0.039 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 16
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
auf Bestellung 194 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 7.55 EUR |
| 10+ | 6.86 EUR |
| 100+ | 6.04 EUR |
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Technische Details CLM-108-02-L-D Samtec Inc.
Description: CONN RCPT 16POS 0.039 GOLD SMD, Packaging: Bulk, Connector Type: Receptacle, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 16, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.039" (1.00mm), Number of Rows: 2.
Weitere Produktangebote CLM-108-02-L-D nach Preis ab 5.7 EUR bis 7.87 EUR
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CLM-108-02-L-D | Hersteller : Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket |
auf Bestellung 120 Stücke: Lieferzeit 10-14 Tag (e) |
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