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CLM-113-02-L-D

CLM-113-02-L-D Samtec

clm_sm-2853999.pdf Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
auf Bestellung 153 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
4+15.91 EUR
25+ 14.38 EUR
84+ 13.36 EUR
504+ 12.35 EUR
Mindestbestellmenge: 4
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Technische Details CLM-113-02-L-D Samtec

Description: CONN RCPT 26POS 0.039 GOLD SMD, Packaging: Bulk, Connector Type: Receptacle, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 26, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.089" (2.26mm), Row Spacing - Mating: 0.039" (1.00mm), Number of Rows: 2.

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CLM-113-02-L-D CLM-113-02-L-D Hersteller : Samtec Inc. clm_sm.pdf Description: CONN RCPT 26POS 0.039 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 26
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.089" (2.26mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
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