CLM-114-02-F-D-BE Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN RCPT 28POS 0.039 GOLD SMD
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.039" (1.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 28
Mounting Type: Surface Mount
Current Rating (Amps): 2.8A per Contact
Connector Type: Receptacle, Bottom Entry
Packaging: Tube
Number of Rows: 2
Row Spacing - Mating: 0.039" (1.00mm)
Insulation Height: 0.084" (2.14mm)
Contact Finish - Post: Tin
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Technische Details CLM-114-02-F-D-BE Samtec Inc.
Description: CONN RCPT 28POS 0.039 GOLD SMD, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.039" (1.00mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 28, Mounting Type: Surface Mount, Current Rating (Amps): 2.8A per Contact, Connector Type: Receptacle, Bottom Entry, Packaging: Tube, Number of Rows: 2, Row Spacing - Mating: 0.039" (1.00mm), Insulation Height: 0.084" (2.14mm), Contact Finish - Post: Tin.
Weitere Produktangebote CLM-114-02-F-D-BE
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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CLM-114-02-F-D-BE | Hersteller : Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |