CLM-135-02-L-D SAMTEC
Hersteller: SAMTEC
Description: SAMTEC - CLM-135-02-L-D - Printbuchse, Board-to-Board, 1 mm, 2 Reihe(n), 70 Kontakt(e), Oberflächenmontage, Tiger Claw CLM
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: 0
rohsCompliant: YES
Rastermaß: 0
Anzahl der Kontakte: 0
euEccn: NLR
Steckverbindersysteme: 0
Anzahl der Reihen: 0
Kontaktmaterial: 0
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Steckverbindermontage: 0
Produktpalette: Tiger Claw CLM
SVHC: No SVHC (14-Jun-2023)
Description: SAMTEC - CLM-135-02-L-D - Printbuchse, Board-to-Board, 1 mm, 2 Reihe(n), 70 Kontakt(e), Oberflächenmontage, Tiger Claw CLM
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: 0
rohsCompliant: YES
Rastermaß: 0
Anzahl der Kontakte: 0
euEccn: NLR
Steckverbindersysteme: 0
Anzahl der Reihen: 0
Kontaktmaterial: 0
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Steckverbindermontage: 0
Produktpalette: Tiger Claw CLM
SVHC: No SVHC (14-Jun-2023)
auf Bestellung 4 Stücke:
Lieferzeit 14-21 Tag (e)
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Technische Details CLM-135-02-L-D SAMTEC
Description: CONN RCPT 70POS 0.039 GOLD SMD, Packaging: Bulk, Connector Type: Receptacle, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 70, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.089" (2.26mm), Row Spacing - Mating: 0.039" (1.00mm), Number of Rows: 2.
Weitere Produktangebote CLM-135-02-L-D
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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CLM-135-02-L-D | Hersteller : Samtec Inc. |
Description: CONN RCPT 70POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 70 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.089" (2.26mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-135-02-L-D | Hersteller : Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |