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CLP-107-02-L-D-P-TR

CLP-107-02-L-D-P-TR Samtec Inc.


clp_sm.pdf Hersteller: Samtec Inc.
Description: CONN RCPT 14POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 14
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
auf Bestellung 1200 Stücke:

Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3+9.05 EUR
10+ 8.23 EUR
100+ 7.25 EUR
500+ 6.16 EUR
Mindestbestellmenge: 3
Produktrezensionen
Produktbewertung abgeben

Technische Details CLP-107-02-L-D-P-TR Samtec Inc.

Description: CONN RCPT 14POS 0.05 GOLD SMD, Packaging: Tape & Reel (TR), Features: Pick and Place, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 14, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.

Weitere Produktangebote CLP-107-02-L-D-P-TR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
CLP-107-02-L-D-P-TR Hersteller : SAMTEC SAMI-S-A0010445273-1.pdf?hkey=6D3A4C79FDBF58556ACFDE234799DDF0 Description: SAMTEC - CLP-107-02-L-D-P-TR - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 14 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
rohsCompliant: YES
Rastermaß: 1.27mm
Anzahl der Kontakte: 14Contacts
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Anzahl der Reihen: 2Rows
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Steckverbindermontage: Oberflachenmontage
SVHC: No SVHC (14-Jun-2023)
auf Bestellung 3 Stücke:
Lieferzeit 14-21 Tag (e)
CLP-107-02-L-D-P-TR CLP-107-02-L-D-P-TR Hersteller : Samtec Inc. clp_sm.pdf Description: CONN RCPT 14POS 0.05 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Pick and Place
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 14
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
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