CLP-111-02-F-D-BE Samtec
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 5.54 EUR |
| 25+ | 5.19 EUR |
| 120+ | 4.17 EUR |
| 520+ | 3.84 EUR |
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Technische Details CLP-111-02-F-D-BE Samtec
Description: CONN RCPT 22POS 0.05 GOLD SMD, Packaging: Tube, Connector Type: Receptacle, Bottom Entry, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 22, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Weitere Produktangebote CLP-111-02-F-D-BE nach Preis ab 7.10 EUR bis 8.87 EUR
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CLP-111-02-F-D-BE | Hersteller : Samtec Inc. |
 Description: CONN RCPT 22POS 0.05 GOLD SMDPackaging: Tube Connector Type: Receptacle, Bottom Entry Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 22 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
auf Bestellung 158 Stücke: Lieferzeit 10-14 Tag (e) |
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