CLP-111-02-F-D Samtec
| Anzahl | Privatkunde |
|---|---|
| 1+ | 5.99 EUR |
| 25+ | 5.62 EUR |
| 120+ | 5.05 EUR |
| 520+ | 4.16 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details CLP-111-02-F-D Samtec
Description: CONN RCPT 22POS 0.05 GOLD SMD, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.090" (2.29mm), Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 22, Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Packaging: Bulk, Part Status: Active, Contact Finish - Post: Tin.
Weitere Produktangebote CLP-111-02-F-D nach Preis ab 5.88 EUR bis 9.12 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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CLP-111-02-F-D | Samtec Inc. |
 Description: CONN RCPT 22POS 0.05 GOLD SMDNumber of Rows: 2 Row Spacing - Mating: 0.050" (1.27mm) Insulation Height: 0.090" (2.29mm) Contact Finish Thickness - Mating: 3.90µin (0.099µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 22 Mounting Type: Surface Mount Current Rating (Amps): 3.3A per Contact Voltage Rating: 240VAC, 330VDC Connector Type: Receptacle Packaging: Bulk Part Status: Active Contact Finish - Post: Tin |
auf Bestellung 426 Stücke: Lieferzeit 10-14 Tag (e) |
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CLP-111-02-F-D | SAMTEC |
Description: SAMTEC - CLP-111-02-F-D - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 22 Kontakt(e), Oberflächenmontage, CLP tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze Steckverbindermontage: Oberflächenmontage usEccn: EAR99 Anzahl der Kontakte: 22Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: CLP productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (25-Jun-2025) |
auf Bestellung 28 Stücke: Lieferzeit 14-21 Tag (e) |
|
| CLP-111-02-F-D |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 22POS 0.05 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.090" (2.29mm)
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 22
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Packaging: Bulk
Part Status: Active
Contact Finish - Post: Tin
Description: CONN RCPT 22POS 0.05 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.090" (2.29mm)
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 22
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Packaging: Bulk
Part Status: Active
Contact Finish - Post: Tin
auf Bestellung 426 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.33 EUR |
| 10+ | 6.66 EUR |
| 100+ | 5.88 EUR |
| CLP-111-02-F-D |
|
Hersteller: SAMTEC
Description: SAMTEC - CLP-111-02-F-D - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 22 Kontakt(e), Oberflächenmontage, CLP
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
Steckverbindermontage: Oberflächenmontage
usEccn: EAR99
Anzahl der Kontakte: 22Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: CLP
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
SVHC: No SVHC (25-Jun-2025)
Description: SAMTEC - CLP-111-02-F-D - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 22 Kontakt(e), Oberflächenmontage, CLP
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
Steckverbindermontage: Oberflächenmontage
usEccn: EAR99
Anzahl der Kontakte: 22Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: CLP
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
SVHC: No SVHC (25-Jun-2025)
auf Bestellung 28 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 28+ | 9.12 EUR |