CLP-113-02-F-D-P Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN RCPT 26POS 0.05 GOLD SMD
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 26
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Features: Pick and Place
Packaging: Tube
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.090" (2.29mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
| Anzahl | Preis |
|---|---|
| 2+ | 11.77 EUR |
| 10+ | 10.65 EUR |
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Technische Details CLP-113-02-F-D-P Samtec Inc.
Description: CONN RCPT 26POS 0.05 GOLD SMD, Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 26, Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Features: Pick and Place, Packaging: Tube, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.090" (2.29mm), Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm).
Weitere Produktangebote CLP-113-02-F-D-P
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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CLP-113-02-F-D-P | Hersteller : Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket, 0.050 Pitch |
auf Bestellung 78 Stücke: Lieferzeit 10-14 Tag (e) |