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CLP-122-02-G-D

CLP-122-02-G-D Samtec Inc.


clp-1xx-xx-xxx-d-xx-footprint.pdf
Hersteller: Samtec Inc.
Description: CONN RCPT 44POS 0.05 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.090" (2.29mm)
Part Status: Active
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 44
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Packaging: Bulk
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Technische Details CLP-122-02-G-D Samtec Inc.

Description: CONN RCPT 44POS 0.05 GOLD SMD, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.090" (2.29mm), Part Status: Active, Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 44, Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Packaging: Bulk.

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CLP-122-02-G-D CLP-122-02-G-D Hersteller : Samtec clp_1xx_xx_xxx_d_xx_xx_xx_mkt-3304497.pdf Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch
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