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CLP-140-02-L-D

CLP-140-02-L-D Samtec

clp_sm-2758206.pdf Hersteller: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket, 0.050 Pitch
auf Bestellung 194 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.46 EUR
11+24.96 EUR
110+20.7 EUR
253+18.37 EUR
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Technische Details CLP-140-02-L-D Samtec

Description: CONN RCPT 80POS 0.05 GOLD SMD, Packaging: Bulk, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 80, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.

Weitere Produktangebote CLP-140-02-L-D

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CLP-140-02-L-D CLP-140-02-L-D Hersteller : Samtec Inc. clp-1xx-xx-xxx-d-xx-xx-xx-mkt.pdf Description: CONN RCPT 80POS 0.05 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 80
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
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