CN0073 Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: USB - C (USB 3.1 GEN 2, SUPERSPE
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: Connector to DIP
Package Accepted: USB - C
Part Status: Active
auf Bestellung 79 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 32.45 EUR |
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Technische Details CN0073 Chip Quik Inc.
Description: USB - C (USB 3.1 GEN 2, SUPERSPE, Packaging: Bulk, Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 24, Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: Connector to DIP, Package Accepted: USB - C, Part Status: Active.