conga-QMX6/HSP3-T congatec
Hersteller: congatec
Heat Sinks Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.
Heat Sinks Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.
auf Bestellung 154 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 42.06 EUR |
| 10+ | 39.55 EUR |
| 25+ | 37.96 EUR |
| 50+ | 37.77 EUR |
| 250+ | 36.77 EUR |
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Technische Details conga-QMX6/HSP3-T congatec
Heat Sinks Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5..