conga-TCA5/i-CSP-B congatec
Hersteller: congatecHeat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
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Technische Details conga-TCA5/i-CSP-B congatec
Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole..