CPG-02-TH-B CUI Devices
Hersteller: CUI DevicesCircuit Board Hardware - PCB Pogopin, Through Hole,9.0mm min Working Height, Bulk Packaging
auf Bestellung 4865 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 1.46 EUR |
| 10+ | 1.23 EUR |
| 100+ | 1.11 EUR |
| 500+ | 0.9 EUR |
| 1000+ | 0.8 EUR |
| 2500+ | 0.73 EUR |
| 5000+ | 0.65 EUR |
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Technische Details CPG-02-TH-B CUI Devices
Description: POGOPIN, THROUGH HOLE,9.0MM MIN, Packaging: Bag, Contact Finish: Gold, Mounting Type: Through Hole, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Brass Alloy, Mating Cycles: 10000, Maximum Working Height: 0.449" (11.40mm), Recommended Working Height: 0.394" (10.00mm), Minimum Working Height: 0.355" (9.01mm), Pad Layout Dimension: Circular - 0.059" (1.50mm) (TH), Plunger Size: 0.031" (0.80mm) Dia, Operating Force - Initial: 45gf, Operating Force - Mid Compression: 120gf.
Weitere Produktangebote CPG-02-TH-B nach Preis ab 0.73 EUR bis 1.46 EUR
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CPG-02-TH-B | Hersteller : CUI Devices |
Description: POGOPIN, THROUGH HOLE,9.0MM MIN Packaging: Bag Contact Finish: Gold Mounting Type: Through Hole Contact Type: Sleeve & Plunger (Pogo Pins) Contact Finish Thickness: 20.0µin (0.51µm) Contact Material: Brass Alloy Mating Cycles: 10000 Maximum Working Height: 0.449" (11.40mm) Recommended Working Height: 0.394" (10.00mm) Minimum Working Height: 0.355" (9.01mm) Pad Layout Dimension: Circular - 0.059" (1.50mm) (TH) Plunger Size: 0.031" (0.80mm) Dia Operating Force - Initial: 45gf Operating Force - Mid Compression: 120gf |
auf Bestellung 4919 Stücke: Lieferzeit 10-14 Tag (e) |
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