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CPG-04-B

CPG-04-B CUI Devices


cpg_04_b-3398108.pdf Hersteller: CUI Devices
Circuit Board Hardware - PCB Pogopin, SMT, 15.5mm max Height, Bulk Packaging
auf Bestellung 4999 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+3.5 EUR
10+ 3.04 EUR
100+ 2.71 EUR
500+ 2.25 EUR
1000+ 1.94 EUR
2500+ 1.8 EUR
5000+ 1.67 EUR
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Technische Details CPG-04-B CUI Devices

Description: POGOPIN, SMT, 15.5MM MAX HEIGHT,, Packaging: Bag, Contact Finish: Gold, Mounting Type: Surface Mount, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Brass Alloy, Mating Cycles: 10000, Maximum Working Height: 0.610" (15.50mm), Recommended Working Height: 0.587" (14.90mm), Minimum Working Height: 0.547" (13.90mm), Pad Layout Dimension: Circular - 0.079" (2.00mm), Plunger Size: 0.039" (1.00mm) Dia, Operating Force - Initial: 125gf, Operating Force - Mid Compression: 180gf.

Weitere Produktangebote CPG-04-B

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CPG-04-B CPG-04-B Hersteller : CUI Devices cpg-04-b.pdf Description: POGOPIN, SMT, 15.5MM MAX HEIGHT,
Packaging: Bag
Contact Finish: Gold
Mounting Type: Surface Mount
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Brass Alloy
Mating Cycles: 10000
Maximum Working Height: 0.610" (15.50mm)
Recommended Working Height: 0.587" (14.90mm)
Minimum Working Height: 0.547" (13.90mm)
Pad Layout Dimension: Circular - 0.079" (2.00mm)
Plunger Size: 0.039" (1.00mm) Dia
Operating Force - Initial: 125gf
Operating Force - Mid Compression: 180gf
auf Bestellung 4665 Stücke:
Lieferzeit 10-14 Tag (e)