CPG-04-B CUI Devices
Hersteller: CUI Devices
Circuit Board Hardware - PCB Pogopin, SMT, 15.5mm max Height, Bulk Packaging
Circuit Board Hardware - PCB Pogopin, SMT, 15.5mm max Height, Bulk Packaging
auf Bestellung 4999 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 3.5 EUR |
10+ | 3.04 EUR |
100+ | 2.71 EUR |
500+ | 2.25 EUR |
1000+ | 1.94 EUR |
2500+ | 1.8 EUR |
5000+ | 1.67 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details CPG-04-B CUI Devices
Description: POGOPIN, SMT, 15.5MM MAX HEIGHT,, Packaging: Bag, Contact Finish: Gold, Mounting Type: Surface Mount, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Brass Alloy, Mating Cycles: 10000, Maximum Working Height: 0.610" (15.50mm), Recommended Working Height: 0.587" (14.90mm), Minimum Working Height: 0.547" (13.90mm), Pad Layout Dimension: Circular - 0.079" (2.00mm), Plunger Size: 0.039" (1.00mm) Dia, Operating Force - Initial: 125gf, Operating Force - Mid Compression: 180gf.
Weitere Produktangebote CPG-04-B
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
CPG-04-B | Hersteller : CUI Devices |
Description: POGOPIN, SMT, 15.5MM MAX HEIGHT, Packaging: Bag Contact Finish: Gold Mounting Type: Surface Mount Contact Type: Sleeve & Plunger (Pogo Pins) Contact Finish Thickness: 20.0µin (0.51µm) Contact Material: Brass Alloy Mating Cycles: 10000 Maximum Working Height: 0.610" (15.50mm) Recommended Working Height: 0.587" (14.90mm) Minimum Working Height: 0.547" (13.90mm) Pad Layout Dimension: Circular - 0.079" (2.00mm) Plunger Size: 0.039" (1.00mm) Dia Operating Force - Initial: 125gf Operating Force - Mid Compression: 180gf |
auf Bestellung 4665 Stücke: Lieferzeit 10-14 Tag (e) |