CSP-6R0L255R-TW Zhi Feng Wei Technology
Hersteller: Zhi Feng Wei TechnologyDescription: 6.0V 2.5F 20*10*22 EDLC
Packaging: Box
Package / Case: Radial, Can
Size / Dimension: 0.787" L x 0.394" W (20.00mm x 10.00mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 65°C
Lead Spacing: 0.610" (15.50mm)
Termination: PC Pins
ESR (Equivalent Series Resistance): 180mOhm @ 1kHz
Lifetime @ Temp.: 1000 Hrs @ 65°C
Height - Seated (Max): 0.925" (23.50mm)
Capacitance: 2.5 F
Voltage - Rated: 6 V
auf Bestellung 304 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 7.44 EUR |
| 10+ | 6.40 EUR |
| 50+ | 5.81 EUR |
| 100+ | 4.80 EUR |
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Technische Details CSP-6R0L255R-TW Zhi Feng Wei Technology
Description: 6.0V 2.5F 20*10*22 EDLC, Packaging: Box, Package / Case: Radial, Can, Size / Dimension: 0.787" L x 0.394" W (20.00mm x 10.00mm), Mounting Type: Through Hole, Operating Temperature: -40°C ~ 65°C, Lead Spacing: 0.610" (15.50mm), Termination: PC Pins, ESR (Equivalent Series Resistance): 180mOhm @ 1kHz, Lifetime @ Temp.: 1000 Hrs @ 65°C, Height - Seated (Max): 0.925" (23.50mm), Capacitance: 2.5 F, Voltage - Rated: 6 V.