CXP-3R0106R-TWQ Zhi Feng Wei Technology
Hersteller: Zhi Feng Wei TechnologyDescription: 10*30 3.0V 10F EDLC
Packaging: Bag
Package / Case: Radial, Can
Size / Dimension: 0.394" Dia (10.00mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 65°C
Lead Spacing: 0.209" (5.30mm)
Termination: PC Pins
ESR (Equivalent Series Resistance): 45mOhm @ 1kHz
Height - Seated (Max): 1.260" (32.00mm)
Part Status: Active
Capacitance: 10 F
Voltage - Rated: 3 V
auf Bestellung 190 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 6.23 EUR |
| 10+ | 4.14 EUR |
| 50+ | 3.29 EUR |
| 100+ | 3.03 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details CXP-3R0106R-TWQ Zhi Feng Wei Technology
Description: 10*30 3.0V 10F EDLC, Packaging: Bag, Package / Case: Radial, Can, Size / Dimension: 0.394" Dia (10.00mm), Mounting Type: Through Hole, Operating Temperature: -40°C ~ 65°C, Lead Spacing: 0.209" (5.30mm), Termination: PC Pins, ESR (Equivalent Series Resistance): 45mOhm @ 1kHz, Height - Seated (Max): 1.260" (32.00mm), Part Status: Active, Capacitance: 10 F, Voltage - Rated: 3 V.