CYT3BB7CEBQ0AEEGST Infineon Technologies
Hersteller: Infineon Technologies
Description: IC MCU 32BT 4.0625MB FLSH 144QFP
Part Status: Active
Supplier Device Package: 144-TEQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 70x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7
EEPROM Size: 256K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 4.0625MB (4.0625M x 8)
Speed: 100MHz, 250MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 116
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Technische Details CYT3BB7CEBQ0AEEGST Infineon Technologies
Description: IC MCU 32BT 4.0625MB FLSH 144QFP, Part Status: Active, Supplier Device Package: 144-TEQFP (20x20), Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT, Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Core Size: 32-Bit Dual-Core, Data Converters: A/D 70x12b SAR, Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7, EEPROM Size: 256K x 8, Program Memory Type: FLASH, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 125°C (TA), RAM Size: 768K x 8, Program Memory Size: 4.0625MB (4.0625M x 8), Speed: 100MHz, 250MHz, Mounting Type: Surface Mount, Package / Case: 144-LQFP Exposed Pad, Packaging: Tape & Reel (TR), DigiKey Programmable: Not Verified, Number of I/O: 116.