CYT3DLABABQ1AESGS Infineon Technologies
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 54.03 EUR |
| 10+ | 47.03 EUR |
| 25+ | 44.92 EUR |
| 100+ | 40.16 EUR |
| 250+ | 38.32 EUR |
| 400+ | 35.64 EUR |
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Technische Details CYT3DLABABQ1AESGS Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH, Packaging: Tray, Package / Case: 216-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 240MHz, Program Memory Size: 4.0625MB (4.0625M x 8), RAM Size: 384K x 8, Operating Temperature: -40°C ~ 105°C (TA), Program Memory Type: FLASH, EEPROM Size: 128K x 8, Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART, Peripherals: DMA, I2S, LVD, Temp Sensor, WDT, Supplier Device Package: 216-TEQFP (24x24), Number of I/O: 108.
Weitere Produktangebote CYT3DLABABQ1AESGS
| Foto | Bezeichnung | Hersteller | Beschreibung |
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CYT3DLABABQ1AESGS | Hersteller : Infineon Technologies |
 Description: TRAVEO-2 CLUST.2.5DGRAPHPackaging: Tray Package / Case: 216-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 4.0625MB (4.0625M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Supplier Device Package: 216-TEQFP (24x24) Number of I/O: 108 |
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