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D0806-42

D0806-42 Harwin

D0XXX.pdf Hersteller: Harwin
IC & Component Sockets 6 WAY 3 LEVEL WIRE WRAP IC SKT
auf Bestellung 2306 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+3.4 EUR
10+2.96 EUR
25+2.9 EUR
70+2.45 EUR
280+2.39 EUR
560+2.18 EUR
1050+1.88 EUR
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Technische Details D0806-42 Harwin

Description: CONN IC DIP SOCKET 6POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 6 (2 x 3), Termination: Wire Wrap, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 196.9µin (5.00µm), Contact Material - Post: Brass, Part Status: Active.

Weitere Produktangebote D0806-42

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D0806-42 D0806-42 Hersteller : Harwin Inc. C004XX_Round_Pin_IC_Sockets.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH