| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.9 EUR |
| 10+ | 4.21 EUR |
| 25+ | 3.8 EUR |
| 104+ | 3.58 EUR |
| 260+ | 3.37 EUR |
| 520+ | 3.22 EUR |
| 1040+ | 3.01 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details D0808-42 Harwin
Description: CONN IC DIP SOCKET 8POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Wire Wrap, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 196.9µin (5.00µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote D0808-42 nach Preis ab 3.19 EUR bis 6.84 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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D0808-42 | Harwin Inc. |
 Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 1957 Stücke: Lieferzeit 10-14 Tag (e) |
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D0808-42 | HARWIN |
Description: HARWIN - D0808-42 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, D08, 7.62 mm, Berylliumkupfer tariffCode: 85366930 euEccn: NLR rohsCompliant: Y-EX Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 8Kontakt(e) SVHC: Lead (04-Feb-2026) Reihenabstand: 7.62mm Steckverbinder: DIP-Sockel Produktpalette: D08 productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 2922 Stücke: Lieferzeit 14-21 Tag (e) |
|
| D0808-42 |
|
Hersteller: Harwin Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 1957 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 5.21 EUR |
| 10+ | 4.43 EUR |
| 25+ | 4.14 EUR |
| 52+ | 3.94 EUR |
| 104+ | 3.75 EUR |
| 260+ | 3.51 EUR |
| 520+ | 3.34 EUR |
| 1040+ | 3.19 EUR |
| D0808-42 |
|
Hersteller: HARWIN
Description: HARWIN - D0808-42 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, D08, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: Y-EX
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 8Kontakt(e)
SVHC: Lead (04-Feb-2026)
Reihenabstand: 7.62mm
Steckverbinder: DIP-Sockel
Produktpalette: D08
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: HARWIN - D0808-42 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, D08, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: Y-EX
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 8Kontakt(e)
SVHC: Lead (04-Feb-2026)
Reihenabstand: 7.62mm
Steckverbinder: DIP-Sockel
Produktpalette: D08
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 2922 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 37+ | 6.84 EUR |
| 49+ | 4.78 EUR |
| 100+ | 3.92 EUR |
| 250+ | 3.75 EUR |