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D0808-42

D0808-42 Harwin

D0XXX-1220532.pdf Hersteller: Harwin
IC & Component Sockets 8 WAY 3 LEVEL WIRE WRAP IC SKT
auf Bestellung 2152 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+3.54 EUR
10+ 2.82 EUR
104+ 2.36 EUR
520+ 2.01 EUR
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Technische Details D0808-42 Harwin

Description: CONN IC DIP SOCKET 8POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Wire Wrap, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 196.9µin (5.00µm), Contact Material - Post: Brass, Part Status: Active.

Weitere Produktangebote D0808-42 nach Preis ab 2.96 EUR bis 3.8 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
D0808-42 D0808-42 Hersteller : Harwin Inc. C004XX_Round_Pin_IC_Sockets.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 124 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+3.8 EUR
10+ 3.31 EUR
25+ 3.17 EUR
50+ 3.1 EUR
100+ 2.96 EUR
Mindestbestellmenge: 5
D0808-42 D0808-42 Hersteller : HARWIN HRWNS04007-1.pdf?hkey=6D3A4C79FDBF58556ACFDE234799DDF0 Description: HARWIN - D0808-42 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, D08, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
rohsCompliant: Y-EX
Rastermaß: 2.54mm
Anzahl der Kontakte: 8Contacts
euEccn: NLR
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
SVHC: Lead (23-Jan-2024)
auf Bestellung 3871 Stücke:
Lieferzeit 14-21 Tag (e)