Produkte > T-GLOBAL TECHNOLOGY > DC0011/08-TI900-0.12-0
DC0011/08-TI900-0.12-0

DC0011/08-TI900-0.12-0 t-Global Technology

Ti900_UK.pdf
Hersteller: t-Global Technology
Description: THERM PAD 19.05MMX12.7MM WHT
Part Status: Active
Backing, Carrier: Viscose
Thermal Conductivity: 1.8W/m-K
Outline: 19.05mm x 12.70mm
Usage: TO-220
Type: Die-Cut Pad, Sheet
Thickness: 0.0050" (0.127mm)
Shape: Rectangular
Material: Silicone
Color: White
Packaging: Box
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Technische Details DC0011/08-TI900-0.12-0 t-Global Technology

Description: THERM PAD 19.05MMX12.7MM WHT, Part Status: Active, Backing, Carrier: Viscose, Thermal Conductivity: 1.8W/m-K, Outline: 19.05mm x 12.70mm, Usage: TO-220, Type: Die-Cut Pad, Sheet, Thickness: 0.0050" (0.127mm), Shape: Rectangular, Material: Silicone, Color: White, Packaging: Box.