DC1813T-10X Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: 10PC DISCRETE 1813 TO 300MIL TH
Packaging: Bulk
Size / Dimension: 0.400" x 0.200" (10.16mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: SMD to DIP
Package Accepted: 1813
Part Status: Active
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Technische Details DC1813T-10X Chip Quik Inc.
Description: 10PC DISCRETE 1813 TO 300MIL TH, Packaging: Bulk, Size / Dimension: 0.400" x 0.200" (10.16mm x 5.08mm), Material: FR4 Epoxy Glass, Number of Positions: 2, Board Thickness: 0.031" (0.79mm) 1/32", Proto Board Type: SMD to DIP, Package Accepted: 1813, Part Status: Active.